JPH022888U - - Google Patents
Info
- Publication number
- JPH022888U JPH022888U JP1988078821U JP7882188U JPH022888U JP H022888 U JPH022888 U JP H022888U JP 1988078821 U JP1988078821 U JP 1988078821U JP 7882188 U JP7882188 U JP 7882188U JP H022888 U JPH022888 U JP H022888U
- Authority
- JP
- Japan
- Prior art keywords
- heat
- electronic circuit
- circuit package
- plate
- attached
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims 2
- 238000005452 bending Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
- H01L2224/331—Disposition
- H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
- H01L2224/33181—On opposite sides of the body
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988078821U JPH022888U (en]) | 1988-06-16 | 1988-06-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988078821U JPH022888U (en]) | 1988-06-16 | 1988-06-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH022888U true JPH022888U (en]) | 1990-01-10 |
Family
ID=31303718
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988078821U Pending JPH022888U (en]) | 1988-06-16 | 1988-06-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH022888U (en]) |
-
1988
- 1988-06-16 JP JP1988078821U patent/JPH022888U/ja active Pending